By reducing friction between the wafer and the cutting tool, it minimizes heat generation and surface damage, while efficiently flushing away debris to prevent accumulation and contamination.

• Lubrication: Reduces friction between the wire saw and wafer, lowering tool wear and producing a smoother cut surface.
• Cooling: Effectively dissipates heat to prevent thermal damage to sensitive wafers.
• Chip Removal: Low surface tension ensures rapid dispersion and removal of fine debris, avoiding clogging and surface contamination.
• Corrosion Protection: Protects wafers (e.g., silicon, GaAs) from chemical attack.
• Cleanliness: Free from contaminants that could create defects, maintaining high wafer purity.
• Wetting & Penetration: Quickly wets wafer surfaces and penetrates the cutting zone, enhancing cutting efficiency.
• Anti-Static: Prevents static buildup during cutting, reducing risk to sensitive materi

Specification

Our coolants are suitable for diamond wire saw applications and offer excellent dispersion, stable cutting performance, and easy recyclability. They are available in both water-based and oil-based formulations, supporting a variety of wire-saw processes. These formulations ensure good abrasive re-dispersion, anti-foam performance, rust prevention, and reliable machine compatibility.

● Non-dilute (concentrated): for standard cutting with higher cutting efficiency.
● Diluted (20–30× or 50×): for lighter cutting or specific grain types, allowing flexible process control.

While providing strong cutting support, these coolants do not contain antiseptic additives, so replacement every 1–6 months is recommended, with monitoring for mold growth.

For product inquiries or technical consultation, please fill out the form below or contact us directly at +886-4-25332210. Our team will promptly assist you and provide a complete cooling solution tailored to your needs.