To optimize these critical early-stage processes, Hai Lu Jya He (HLJH) provides next-generation slicing and lapping fluids. Our targeted solutions empower global manufacturers to achieve ultra-low surface roughness, maximize wafer yield, and maintain flawless process stability.

• GL-10 & GL-10P Glycol Formulation： Engineered for non-dilute operations. It ensures uniform cutting behavior and superior wafer-to-wafer surface consistency.
• LW-10 Synthetic Oil-Based Formulation： Specifically synthesized for advanced semiconductor slicing, delivering high-film-strength boundary lubrication paired with rapid heat dissipation to extend wire life.
• SW-30 High-Flushing Water-Soluble Formulation：Tailored for high-speed diamond wire-saw systems. It features exceptional swarf-flushing capacity, preventing particle agglomeration and sub-surface damage.

• LP-40 Boron-Free Eco-Compliant Fluid：A single-component, water-soluble solution that yields highly uniform polishing action and superior abrasive particle dispersion.
• LP-50 Anti-Rust Performance Fluid：Infused with specialized organic salts, this formulation prevents grit sedimentation while delivering robust, long-lasting corrosion protection for multi-metal environments.

In the semiconductor industry, coolants and oils are a very small part of the cost, but they have a huge impact on the whole process. We know that top semiconductor factories have extremely strict rules. Having standard certificates is just the first step—you always need to pass long, rigorous matching tests inside the factory before you can use a new fluid. MORESCO coolants are designed exactly to pass these tough qualification tests. Our fluids keep the wafer surface perfectly smooth, prevent cracks, and make your diamond wires last much longer, fully protecting your daily production yield.